SpringerLink (Online service), Horiuchi, S., Terasaki, N., & Miyamae, T. (2024). Interfacial Phenomena in Adhesion and Adhesive Bonding (1st ed. 2024.). Springer Nature Singapore : Imprint: Springer. https://doi.org/10.1007/978-981-99-4456-9
Cita Chicago Style (17a ed.)SpringerLink (Online service), Shin Horiuchi, Nao Terasaki, y Takayuki Miyamae. Interfacial Phenomena in Adhesion and Adhesive Bonding. 1st ed. 2024. Singapore: Springer Nature Singapore : Imprint: Springer, 2024. https://doi.org/10.1007/978-981-99-4456-9.
Cita MLA (9a ed.)SpringerLink (Online service), et al. Interfacial Phenomena in Adhesion and Adhesive Bonding. 1st ed. 2024. Springer Nature Singapore : Imprint: Springer, 2024. https://doi.org/10.1007/978-981-99-4456-9.
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