Dynamic Behavior of Materials

• Other Authors: Wang, Chuanting (Editor), He, Yong (Editor), Zheng, Yuanfeng (Editor), Zhang, Shuhai (Editor), Tang, Wenhui (Editor)
• Format: Electronic Book Chapter
• Language: English
• Published: Basel MDPI - Multidisciplinary Digital Publishing Institute 2023
• Subjects: Research & information: general; Physics; reactive material; shaped charge jet; trans-scale discretization; formation; unsaturated clay; moisture content; Hugoniot parameters; high-pressure EOS; multi-diameter tungsten fiber-reinforced Zr-based bulk metallic glasses matrix composite; tungsten fiber; penetration failure mode; bend space; ultimate bending diameter; explosively formed projectile; tungsten heavy alloy; liner material; dynamic response; fracture mechanics; Johnson-Kendall-Robert model; polyurethane setae array; surface energy; modeling; simulation; reactive materials; impact-induced deflagration; ignition behavior; reaction ratio; temperature distribution; dynamic modeling; impact; kinetic projectile; honeycomb; multi-layer plates; dynamic model; weaved composite material; unmanned aerial vehicle; parachute recovery; deployment phase; parameter analysis; fine-grained D6A steel; fine grain strengthening; strain rate sensitivity; Johnson-Cook constitutive model; finite element simulation; ceramic composite armor; 12.7 mm API projectile; ballistic performance; deflection and yaw; NM500/Q345 clad plate; austenitization; microstructure; properties; movement; inclusions; cold hearth; flow field; PTFE/Al; reactive shaped charge jet; numerical simulation; near-α titanium alloy; dynamic deformation; deformation twin; Johnson-Cook equation; reactive materials projectile; multi-layer aluminum target; damage evolutionary behavior; deflagration reaction; n/a
• Online Access: DOAB: download the publication; DOAB: description of the publication

This Special Issue on the "Dynamic Behavior of Materials" collected recent research findings on the dynamic behavior of various materials. A collection of fifteen peer-reviewed research articles were included in this Special Issue. The main topics covered include processing technology, state-of-the-art characterization, testing, theoretic modeling, and simulation. We hope that this Special Issue will be interesting for the academic community, and also hope that it will shed light on future research activities in this field.