Entwicklung keramischer Vergussmassen mit Alkoxysilanen zur Steigerung der Haftfestigkeit

The adhesion of encapsulation materials is an dendrimental factor for the robustness and functionality of a power electronic device. In this work the adhesion of ceramic potting materials was developed. A new primer was invented, that enabled high shear strengths even at high temperatures for short...

Descrizione completa

Salvato in:
Dettagli Bibliografici
Autore principale: Kohler, Tobias (auth)
Natura: Elettronico Capitolo di libro
Pubblicazione: KIT Scientific Publishing 2023
Soggetti:
Accesso online:DOAB: download the publication
DOAB: description of the publication
Tags: Aggiungi Tag
Nessun Tag, puoi essere il primo ad aggiungerne!!