Chemical Bond and Intermolecular Interactions

• Autres auteurs: Li, Qingzhong (Éditeur intellectuel), Scheiner, Steve (Éditeur intellectuel), Yu, Zhiwu (Éditeur intellectuel)
• Format: Électronique Chapitre de livre
• Langue: anglais
• Publié: Basel MDPI - Multidisciplinary Digital Publishing Institute 2023
• Sujets: Research & information: general; Biology, life sciences; triel bond; hydrogen bonding; proton transfer; NBO; halogen bonding; haloforms; Amines; NMR spectroscopy; UV-Vis spectroscopy; DFT calculations; X-ray crystallography; halogen bond; QTAIM; energy density; pyrazole; electron density; hcb net; metallic anion; nucleophilic substitution reaction; quantum chemistry calculation; reductive elimination; hydrogen bond; abnormality; competition; AIM; cysteine dimers; NCI; stochastic optimization; salt bridges; non-covalent interactions; dihydrogen bonding; local vibrational mode analysis; blue/red shifts; hydride complexes; hydrogen storage; halogen bonds; density functional theory; energy decomposition analysis; ring current analysis; spin-orbit coupling; ortho-carborane; iodo derivatives; X-ray structure; I⋯I dihalogen bond; vinyl cations; vinyl cation adduct; very strong H-bond; proton disolvate; carborane salt
• Accès en ligne: DOAB: download the publication; DOAB: description of the publication

Résumé

This reprint focuses on the geometrical and spectroscopic features as well as potential applications of halogen, chalcogen, pnictogen, tetrel, and triel bonds in chemical reactions, crystal engineering, molecular recognition, and biological systems. We particularly aim to present studies concerning the bonds formed between some novel important electron donors and acceptors, similarities and differences between these bonds, structures of the complexes composed of these bonds in solution and gas phases, spectroscopic methods for measuring these bonds in solution and gas phases, and applications of these bonds in chemical reactions, crystal engineering, molecular recognition, and biological systems.

Description matérielle

1 electronic resource (162 p.)

ISBN

books978-3-0365-9869-7
9783036598703
9783036598697

Accès

Open Access