Influence of strain on the functionality of ink-jet printed thin films and devices on flexible substrates
Ink-jet printed devices on the flexible substrate are inexpensive and large area compatible as compared to rigid substrates. However, during fabrication and service they are subjected to complex strains, resulting in crack formation or delamination within the layers, affecting the device performance...
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| Main Author: | |
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| Format: | Electronic Book Chapter |
| Language: | English |
| Published: |
KIT Scientific Publishing
2019
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| Series: | Schriftenreihe des Instituts für Angewandte Materialien, Karlsruher Institut für Technologie
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| Subjects: | |
| Online Access: | DOAB: download the publication DOAB: description of the publication |
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| 072 | 7 | |a TB |2 bicssc | |
| 100 | 1 | |a Mishra, Nilesha |4 auth | |
| 245 | 1 | 0 | |a Influence of strain on the functionality of ink-jet printed thin films and devices on flexible substrates |
| 260 | |b KIT Scientific Publishing |c 2019 | ||
| 300 | |a 1 electronic resource (X, 127 p. p.) | ||
| 336 | |a text |b txt |2 rdacontent | ||
| 337 | |a computer |b c |2 rdamedia | ||
| 338 | |a online resource |b cr |2 rdacarrier | ||
| 490 | 1 | |a Schriftenreihe des Instituts für Angewandte Materialien, Karlsruher Institut für Technologie | |
| 506 | 0 | |a Open Access |2 star |f Unrestricted online access | |
| 520 | |a Ink-jet printed devices on the flexible substrate are inexpensive and large area compatible as compared to rigid substrates. However, during fabrication and service they are subjected to complex strains, resulting in crack formation or delamination within the layers, affecting the device performance. Therefore, it is necessary to understand their failure mechanisms by correlating their electrical or structural properties with applied strain, supported by detailed microstructural investigations. | ||
| 540 | |a Creative Commons |f https://creativecommons.org/licenses/by-sa/4.0/ |2 cc |4 https://creativecommons.org/licenses/by-sa/4.0/ | ||
| 546 | |a English | ||
| 650 | 7 | |a Technology: general issues |2 bicssc | |
| 653 | |a elektromechanische Charakterisierung | ||
| 653 | |a flexible Elektronik | ||
| 653 | |a thin-film devices | ||
| 653 | |a Ink-jet printing | ||
| 653 | |a flexible electronics | ||
| 653 | |a synchrotron X-ray diffraction | ||
| 653 | |a Dünnschichtbauteil | ||
| 653 | |a Ink-jet drucken | ||
| 653 | |a Synchrotron-Röntgenbeugung | ||
| 653 | |a electro-mechanical characterization | ||
| 856 | 4 | 0 | |a www.oapen.org |u https://www.ksp.kit.edu/9783731508533 |7 0 |z DOAB: download the publication |
| 856 | 4 | 0 | |a www.oapen.org |u https://directory.doabooks.org/handle/20.500.12854/50197 |7 0 |z DOAB: description of the publication |