Micromechanical finite element simulations of crack propagation in silicon nitride

• Yazar: Wippler, Johannes (auth)
• Materyal Türü: Elektronik Kitap Bölümü
• Dil: İngilizce
• Baskı/Yayın Bilgisi: KIT Scientific Publishing 2012
• Seri Bilgileri: Schriftenreihe Kontinuumsmechanik im Maschinenbau / Karlsruher Institut für Technologie, Institut für Technische Mechanik - Bereich Kontinuumsmechanik
• Konular: Technology: general issues; silicon nitride; finite element simulation; toughness; structure; fracture
• Online Erişim: DOAB: download the publication; DOAB: description of the publication

Silicon nitride is used for challening applications like cutting inserts or forming rolls. The extreme strength and toughness of the material is achieved by an interaction between the microstructure and fracture behaviour on the microlevel. In order to understand these mechanisms, detailed unit cell...