Electroplating of Nanostructures
The electroplating was widely used to electrodeposit the nanostructures because of its relatively low deposition temperature, low cost and controlling the thickness of the coatings. With advances in electronics and microprocessor, the amount and form of the electrodeposition current applied can be c...
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Format: | Electronic Book Chapter |
Language: | English |
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IntechOpen
2015
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Online Access: | DOAB: download the publication DOAB: description of the publication |
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100 | 1 | |a Aliofkhazraei, Mahmood |4 edt | |
700 | 1 | |a Aliofkhazraei, Mahmood |4 oth | |
245 | 1 | 0 | |a Electroplating of Nanostructures |
260 | |b IntechOpen |c 2015 | ||
300 | |a 1 electronic resource (318 p.) | ||
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506 | 0 | |a Open Access |2 star |f Unrestricted online access | |
520 | |a The electroplating was widely used to electrodeposit the nanostructures because of its relatively low deposition temperature, low cost and controlling the thickness of the coatings. With advances in electronics and microprocessor, the amount and form of the electrodeposition current applied can be controlled. The pulse electrodeposition has the interesting advantages such as higher current density application, higher efficiency and more variable parameters compared to direct current density. This book collects new developments about electroplating and its use in nanotechnology. | ||
540 | |a Creative Commons |f https://creativecommons.org/licenses/by/3.0/ |2 cc |4 https://creativecommons.org/licenses/by/3.0/ | ||
546 | |a English | ||
650 | 7 | |a Condensed matter physics (liquid state & solid state physics) |2 bicssc | |
653 | |a Condensed matter physics (liquid state & solid state physics) | ||
856 | 4 | 0 | |a www.oapen.org |u https://mts.intechopen.com/storage/books/4718/authors_book/authors_book.pdf |7 0 |z DOAB: download the publication |
856 | 4 | 0 | |a www.oapen.org |u https://directory.doabooks.org/handle/20.500.12854/66783 |7 0 |z DOAB: description of the publication |