Self-Assembly of Nanostructures and Patchy Nanoparticles
Top-down approaches are currently the main contributor of fabricating microelectronic devices. However, the prohibitive cost of numerous technological steps in these approaches is the main obstacle to further progress. Furthermore, a large number of applications necessitate fabrication of complex an...
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| Format: | Elektronisch Buchkapitel |
| Sprache: | Englisch |
| Veröffentlicht: |
IntechOpen
2020
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| Online-Zugang: | DOAB: download the publication DOAB: description of the publication |
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