APA (7th ed.) Citation

Seok, S. (2022). MEMS Packaging Technologies and 3D Integration. MDPI - Multidisciplinary Digital Publishing Institute.

Chicago Style (17th ed.) Citation

Seok, Seonho. MEMS Packaging Technologies and 3D Integration. MDPI - Multidisciplinary Digital Publishing Institute, 2022.

MLA (9th ed.) Citation

Seok, Seonho. MEMS Packaging Technologies and 3D Integration. MDPI - Multidisciplinary Digital Publishing Institute, 2022.

Warning: These citations may not always be 100% accurate.