MEMS Packaging Technologies and 3D Integration
This Special Issue introduces recent research results on MEMS packaging and 3D integration whose subjects can be divided as follow; three papers on biocompatible implantable packaging, three papers on interconnect, three papers on bonding technologies, one paper on vacuum packaging, and three papers...
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| Format: | Electronic Book Chapter |
| Language: | English |
| Published: |
MDPI - Multidisciplinary Digital Publishing Institute
2022
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| Subjects: | |
| Online Access: | DOAB: download the publication DOAB: description of the publication |
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| 245 | 1 | 0 | |a MEMS Packaging Technologies and 3D Integration |
| 260 | |b MDPI - Multidisciplinary Digital Publishing Institute |c 2022 | ||
| 300 | |a 1 electronic resource (210 p.) | ||
| 336 | |a text |b txt |2 rdacontent | ||
| 337 | |a computer |b c |2 rdamedia | ||
| 338 | |a online resource |b cr |2 rdacarrier | ||
| 506 | 0 | |a Open Access |2 star |f Unrestricted online access | |
| 520 | |a This Special Issue introduces recent research results on MEMS packaging and 3D integration whose subjects can be divided as follow; three papers on biocompatible implantable packaging, three papers on interconnect, three papers on bonding technologies, one paper on vacuum packaging, and three papers on modeling and simulation. | ||
| 540 | |a Creative Commons |f https://creativecommons.org/licenses/by/4.0/ |2 cc |4 https://creativecommons.org/licenses/by/4.0/ | ||
| 546 | |a English | ||
| 650 | 7 | |a Research & information: general |2 bicssc | |
| 650 | 7 | |a Biology, life sciences |2 bicssc | |
| 653 | |a heterogeneous integration | ||
| 653 | |a wafer bonding | ||
| 653 | |a wafer sealing | ||
| 653 | |a room-temperature bonding | ||
| 653 | |a Au-Au bonding | ||
| 653 | |a surface activated bonding | ||
| 653 | |a Au film thickness | ||
| 653 | |a surface roughness | ||
| 653 | |a microelectromechanical systems (MEMS) packaging | ||
| 653 | |a inkjet printing | ||
| 653 | |a redistribution layers | ||
| 653 | |a capacitive micromachined ultrasound transducers (CMUT) | ||
| 653 | |a fan-out wafer-level packaging (FOWLP) | ||
| 653 | |a adhesion | ||
| 653 | |a thin film metal | ||
| 653 | |a parylene | ||
| 653 | |a neural probe | ||
| 653 | |a scotch tape test | ||
| 653 | |a FEM | ||
| 653 | |a MEMS resonator | ||
| 653 | |a temperature coefficient | ||
| 653 | |a thermal stress | ||
| 653 | |a millimeter-wave | ||
| 653 | |a redundant TSV | ||
| 653 | |a equivalent circuit model | ||
| 653 | |a S-parameters extraction | ||
| 653 | |a technology evaluation | ||
| 653 | |a MEMS and IC integration | ||
| 653 | |a MCDM | ||
| 653 | |a fuzzy AHP | ||
| 653 | |a fuzzy VIKOR | ||
| 653 | |a fan-out wafer-level package | ||
| 653 | |a finite element | ||
| 653 | |a glass substrate | ||
| 653 | |a reliability life | ||
| 653 | |a packaging-on-packaging | ||
| 653 | |a thermal sensors | ||
| 653 | |a TMOS sensor | ||
| 653 | |a finite difference time domain | ||
| 653 | |a optical and electromagnetics simulations | ||
| 653 | |a finite element analysis | ||
| 653 | |a ultrasonic bonding | ||
| 653 | |a metal direct bonding | ||
| 653 | |a microsystem integration | ||
| 653 | |a biocompatible packaging | ||
| 653 | |a implantable | ||
| 653 | |a reliability | ||
| 653 | |a Finite element method (FEM) | ||
| 653 | |a simulation | ||
| 653 | |a multilayer reactive bonding | ||
| 653 | |a integrated nanostructure-multilayer reactive system | ||
| 653 | |a spontaneous self-ignition | ||
| 653 | |a self-propagating exothermic reaction | ||
| 653 | |a Pd/Al reactive multilayer system | ||
| 653 | |a Ni/Al reactive multilayer system | ||
| 653 | |a low-temperature MEMS packaging | ||
| 653 | |a crack propagation | ||
| 653 | |a microbump | ||
| 653 | |a deflection angle | ||
| 653 | |a stress intensity factor (SIF) | ||
| 653 | |a polymer packaging | ||
| 653 | |a neural interface | ||
| 653 | |a chronic implantation | ||
| 653 | |a n/a | ||
| 856 | 4 | 0 | |a www.oapen.org |u https://mdpi.com/books/pdfview/book/5558 |7 0 |z DOAB: download the publication |
| 856 | 4 | 0 | |a www.oapen.org |u https://directory.doabooks.org/handle/20.500.12854/84576 |7 0 |z DOAB: description of the publication |