Selected Papers from 2020 IEEE International Conference on High Voltage Engineering (ICHVE 2020)

• Other Authors: Fofana, Issouf (Editor), Zhang, Bo (Editor)
• Format: Electronic Book Chapter
• Language: English
• Published: Basel MDPI - Multidisciplinary Digital Publishing Institute 2023
• Subjects: Technology: general issues; History of engineering & technology; AC-DC combined voltage; oil-paper insulation; creepage discharge; OS-ELM; pattern recognition; grounding; discharge channel; X-ray; successive impulse; gray information; transient analysis model; power cable; fault location; sheath current; traveling wave; unsupervised learning; micro and nanoparticles; adding order; dielectric properties; AC breakdown strength; current transformer; finite element analysis; electro-thermal coupling; thermal field; oil-film dielectric; accumulative effect; time-domain dielectric response; matrix pencil algorithm; extended Debye model; finite element; composite insulator; electric field strength; operating state; pollution flashover; ZnO varistors; DC aging; double Schottky barrier; point defects; cable accessories; infrared image processing; Faster RCNN; Mean-Shift algorithm; smart condition diagnosis; polyethylene; micro/nanocomposite; hexagonal boron nitride; charge transport; DC breakdown; orientation; trap characteristics; discharge channel morphology characteristics; critical breakdown field strength; residual resistivity; X-ray imaging technology; UHV GIL; transient voltage; on-line monitoring system; UWB voltage sensing; sulfur hexafluoride; SF6; insulation; dielectric medium; SF6-free; SF6-alternative; fluoroketone; fluoronitrile; high soil resistivity; soil discharge; X-ray imaging; super absorbent polymer; impulse discharge performance; gas insulated switchgear; mechanical defect; vibration; detection and diagnosis; contamination flashover; the local arc; low pressure; optical diagnostic method; n/a
• Online Access: DOAB: download the publication; DOAB: description of the publication

The 2020 IEEE International Conference on High Voltage Engineering (ICHVE 2020) was held on 6-10 September 2020 in Beijing, China. The conference was organized by the Tsinghua University, China, and endorsed by the IEEE Dielectrics and Electrical Insulation Society. This conference has attracted a great deal of attention from researchers around the world in the field of high voltage engineering. The forum offered the opportunity to present the latest developments and different emerging challenges in high voltage engineering, including the topics of ultra-high voltage, smart grids, and insulating materials.