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Hybrid photonic assemblies based on 3D-printed coupling structures

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Photonic integrated circuits (PIC) become increasingly important for numerous applications. Mass production of PIC has become widely available, but large-volume low-cost photonic packaging still represents a challenge. Additive micro-fabrication of free-form optical coupling structures is discussed...

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Váldodahkki: Xu, Yilin (auth)
Materiálatiipa: Elektrovnnalaš Girjji oassi
Giella:eaŋgalasgiella
Almmustuhtton: KIT Scientific Publishing 2023
Ráidu:Karlsruhe Series in Photonics & Communications
Fáttát:
Electrical engineering
Photonische Aufbau- und Verbindungstechnik; integrierte photonische Schaltkreise; Multiphotonenlithographie; additive 3D Mikrofabrikation; Mikrooptik; photonic packaging; photonic integrated circuits (PIC); multi-photon lithographie; additive 3D micro-fabrication; micro-optics
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DOAB: description of the publication
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Govvádus
Čoahkkáigeassu:Photonic integrated circuits (PIC) become increasingly important for numerous applications. Mass production of PIC has become widely available, but large-volume low-cost photonic packaging still represents a challenge. Additive micro-fabrication of free-form optical coupling structures is discussed as a concept to overcome this technology gap. Multi-photon 3D-lithography is used to fabricate dielectric waveguides ("photonic wire bonds", PWB) as well as facet-attached microlenses (FaML).
Olgguldas hápmi:1 electronic resource (292 p.)
ISBN:KSP/1000154744
Beassan:Open Access

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