Hybrid photonic assemblies based on 3D-printed coupling structures

Photonic integrated circuits (PIC) become increasingly important for numerous applications. Mass production of PIC has become widely available, but large-volume low-cost photonic packaging still represents a challenge. Additive micro-fabrication of free-form optical coupling structures is discussed...

詳細記述

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書誌詳細
第一著者:	Xu, Yilin (auth)
フォーマット:	電子媒体図書の章
言語:	英語
出版事項:	KIT Scientific Publishing 2023
シリーズ:	Karlsruhe Series in Photonics & Communications
主題:	Electrical engineering Photonische Aufbau- und Verbindungstechnik; integrierte photonische Schaltkreise; Multiphotonenlithographie; additive 3D Mikrofabrikation; Mikrooptik; photonic packaging; photonic integrated circuits (PIC); multi-photon lithographie; additive 3D micro-fabrication; micro-optics
オンライン･アクセス:	DOAB: download the publication DOAB: description of the publication
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Hybrid photonic assemblies based on 3D-printed coupling structures

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