APA (7th ed.) Citation

Benjang Monkollertsirisuk, Ura Pancharoen, Somboon Manoonsumrit, & Chulalongkorn University. Graduate School. (2013). Development of thermal conductivity of metal-filled epoxy adhesives for microelectronic industry. Chulalongkorn University.

Chicago Style (17th ed.) Citation

Benjang Monkollertsirisuk, Ura Pancharoen, Somboon Manoonsumrit, and Chulalongkorn University. Graduate School. Development of Thermal Conductivity of Metal-filled Epoxy Adhesives for Microelectronic Industry. Chulalongkorn University, 2013.

MLA (9th ed.) Citation

Benjang Monkollertsirisuk, et al. Development of Thermal Conductivity of Metal-filled Epoxy Adhesives for Microelectronic Industry. Chulalongkorn University, 2013.