Uraiwan Pongsa, Anongnat Somwangthanaroj, & Chulalongkorn University. Faculty of Engineering. (2013). Effect of surface modification of multi-walled carbon nanotubes on thermal conductivity of underfill for microelectronic packaging. Chulalongkorn University.
Chicago Style (17th ed.) CitationUraiwan Pongsa, Anongnat Somwangthanaroj, and Chulalongkorn University. Faculty of Engineering. Effect of Surface Modification of Multi-walled Carbon Nanotubes on Thermal Conductivity of Underfill for Microelectronic Packaging. Chulalongkorn University, 2013.
MLA (9th ed.) CitationUraiwan Pongsa, et al. Effect of Surface Modification of Multi-walled Carbon Nanotubes on Thermal Conductivity of Underfill for Microelectronic Packaging. Chulalongkorn University, 2013.
Warning: These citations may not always be 100% accurate.