Effect of surface modification of multi-walled carbon nanotubes on thermal conductivity of underfill for microelectronic packaging
Thesis (D.Eng.)--Chulalongkorn University, 2012
Saved in:
Main Author: | Uraiwan Pongsa (Author) |
---|---|
Other Authors: | Anongnat Somwangthanaroj (Contributor), Chulalongkorn University. Faculty of Engineering (Contributor) |
Format: | Book |
Published: |
Chulalongkorn University,
2013-10-30T03:13:25Z.
|
Subjects: | |
Online Access: | http://cuir.car.chula.ac.th/handle/123456789/36466 |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Similar Items
-
Multi-Walled Carbon Nanotubes
by: Morais, Simone
Published: (2019) -
Development of thermal conductivity of metal-filled epoxy adhesives for microelectronic industry
by: Benjang Monkollertsirisuk
Published: (2013) -
Application of Fe-filled multi-walled carbon nanotubes for removal of antibiotics from aqueous solution
by: Kanokwan Sowichai
Published: (2013) -
Synthesis of Carboxylic Functionalized Multi Wall Carbon Nanotubes and Their Application for Static Charge Dissipative Fibers
by: Waseem Khan, et al.
Published: (2016) -
Effect of Multi-walled Carbon Nanotube on Mechanical Properties of Kenaf/Polypropylene Composites / Zakaria Razak...[et al.]
by: Razak, Zakaria, et al.
Published: (2017)