The Sn-3.5Ag-1.0Cu-0.1Zn/Cu intermetallic interface under thermal aging / Iziana Yahya, Hamidi Abd Hamid and Ramani Mayappan
Due to environmental concerns, lead-free solders were introduced to replace the lead-based solders in microelectronics devices technology. Although there were many lead-free solder available, the Sn-Ag-Cu was considered as the best choice. But the solder has its draw backs in terms of melting temper...
Saved in:
Main Authors: | Yahya, Iziana (Author), Abd Hamid, Hamidi (Author), Mayappan, Ramani (Author) |
---|---|
Format: | Book |
Published: |
Universiti Teknologi MARA, Perlis,
2012-12.
|
Subjects: | |
Online Access: | Link Metadata |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Similar Items
-
Cu6 Sn5 and Cu3 Sn intermetallics study in the Sn-40Pb/Cu system during long-term aging / Ramani Mayappan and Zainal Arifin Ahmad
by: Mayappan, Ramani, et al.
Published: (2010) -
PENGARUH TEMPERATUR DAN LAJU REGANGAN TERHADAP SIFAT MEKANIK MATERIAL SOLDER BEBAS TIMBAL Sn-3.0Ag-0.5Cu
by: Ananda Aransa, -
Published: (2020) -
Reliability Study of Lead Free Sn-3.8Ag-0.7Cu and Copper (Cu) Substrate based on the Microstructure, Physical and Mechanical Properties / Amares Singh...[et al.]
by: Singh, Amares, et al.
Published: (2018) -
Analisis Pengaruh Defek CuZn+ZnCu pada Kristal Cu2ZnSnS4 sebagai Material Sel Surya Menggunakan Teori Fungsi Kerapatan
by: Manopo, Jessie
Published: (2021) -
SINTESIS DAN KARAKTERISASI LAPISAN TIPIS Cu2ZnSnS4 SEBAGAI ABSORBER PADA SEL SURYA MEMANFAATKAN POTENSI MATERIAL Zn
by: Angela Vitadewi, -
Published: (2021)