Singh, A., Durairaj, R., Lee, K. C., & Sia, Y. Y. (2018). Reliability Study of Lead Free Sn-3.8Ag-0.7Cu and Copper (Cu) Substrate based on the Microstructure, Physical and Mechanical Properties / Amares Singh...[et al.]. Faculty of Mechanical Engineering Universiti Teknologi MARA (UiTM).
शिकागो शैली (17वां संस्करण) प्रशस्ति पत्रSingh, Amares, Rajkumar Durairaj, Kong Chian Lee, और Yaw Yoong Sia. Reliability Study of Lead Free Sn-3.8Ag-0.7Cu and Copper (Cu) Substrate Based on the Microstructure, Physical and Mechanical Properties / Amares Singh...[et Al.]. Faculty of Mechanical Engineering Universiti Teknologi MARA (UiTM), 2018.
एमएलए (9वां संस्करण) प्रशस्ति पत्रSingh, Amares, et al. Reliability Study of Lead Free Sn-3.8Ag-0.7Cu and Copper (Cu) Substrate Based on the Microstructure, Physical and Mechanical Properties / Amares Singh...[et Al.]. Faculty of Mechanical Engineering Universiti Teknologi MARA (UiTM), 2018.