APA (7 वां संस्करण) प्रशस्ति पत्र

Singh, A., Durairaj, R., Lee, K. C., & Sia, Y. Y. (2018). Reliability Study of Lead Free Sn-3.8Ag-0.7Cu and Copper (Cu) Substrate based on the Microstructure, Physical and Mechanical Properties / Amares Singh...[et al.]. Faculty of Mechanical Engineering Universiti Teknologi MARA (UiTM).

शिकागो शैली (17वां संस्करण) प्रशस्ति पत्र

Singh, Amares, Rajkumar Durairaj, Kong Chian Lee, और Yaw Yoong Sia. Reliability Study of Lead Free Sn-3.8Ag-0.7Cu and Copper (Cu) Substrate Based on the Microstructure, Physical and Mechanical Properties / Amares Singh...[et Al.]. Faculty of Mechanical Engineering Universiti Teknologi MARA (UiTM), 2018.

एमएलए (9वां संस्करण) प्रशस्ति पत्र

Singh, Amares, et al. Reliability Study of Lead Free Sn-3.8Ag-0.7Cu and Copper (Cu) Substrate Based on the Microstructure, Physical and Mechanical Properties / Amares Singh...[et Al.]. Faculty of Mechanical Engineering Universiti Teknologi MARA (UiTM), 2018.

चेतावनी: ये उद्धरण हमेशा 100% सटीक नहीं हो सकते हैं.