APA (7th ed.) Citation

Singh, A., Durairaj, R., Lee, K. C., & Sia, Y. Y. (2018). Reliability Study of Lead Free Sn-3.8Ag-0.7Cu and Copper (Cu) Substrate based on the Microstructure, Physical and Mechanical Properties / Amares Singh...[et al.]. Faculty of Mechanical Engineering Universiti Teknologi MARA (UiTM).

Chicago Style (17th ed.) Citation

Singh, Amares, Rajkumar Durairaj, Kong Chian Lee, and Yaw Yoong Sia. Reliability Study of Lead Free Sn-3.8Ag-0.7Cu and Copper (Cu) Substrate Based on the Microstructure, Physical and Mechanical Properties / Amares Singh...[et Al.]. Faculty of Mechanical Engineering Universiti Teknologi MARA (UiTM), 2018.

MLA (9th ed.) Citation

Singh, Amares, et al. Reliability Study of Lead Free Sn-3.8Ag-0.7Cu and Copper (Cu) Substrate Based on the Microstructure, Physical and Mechanical Properties / Amares Singh...[et Al.]. Faculty of Mechanical Engineering Universiti Teknologi MARA (UiTM), 2018.