APA (7th ed.) Citation

Lau, K., Hoi, E. K., & Rosli, N. H. (2021). DSC assessment on curing degree of micron-scaled adhesive layer in lamination-pressed flexible printed circuit panels / Kok-Tee Lau, Hoi Ern Kok and Nur Hazirah Rosli. Universiti Teknologi MARA.

Chicago Style (17th ed.) Citation

Lau, Kok-Tee, Ern Kok Hoi, and Nur Hazirah Rosli. DSC Assessment on Curing Degree of Micron-scaled Adhesive Layer in Lamination-pressed Flexible Printed Circuit Panels / Kok-Tee Lau, Hoi Ern Kok and Nur Hazirah Rosli. Universiti Teknologi MARA, 2021.

MLA (9th ed.) Citation

Lau, Kok-Tee, et al. DSC Assessment on Curing Degree of Micron-scaled Adhesive Layer in Lamination-pressed Flexible Printed Circuit Panels / Kok-Tee Lau, Hoi Ern Kok and Nur Hazirah Rosli. Universiti Teknologi MARA, 2021.