Lau, K., Hoi, E. K., & Rosli, N. H. (2021). DSC assessment on curing degree of micron-scaled adhesive layer in lamination-pressed flexible printed circuit panels / Kok-Tee Lau, Hoi Ern Kok and Nur Hazirah Rosli. Universiti Teknologi MARA.
Chicago-viite (17. p.)Lau, Kok-Tee, Ern Kok Hoi, ja Nur Hazirah Rosli. DSC Assessment on Curing Degree of Micron-scaled Adhesive Layer in Lamination-pressed Flexible Printed Circuit Panels / Kok-Tee Lau, Hoi Ern Kok and Nur Hazirah Rosli. Universiti Teknologi MARA, 2021.
MLA-viite (9. p.)Lau, Kok-Tee, et al. DSC Assessment on Curing Degree of Micron-scaled Adhesive Layer in Lamination-pressed Flexible Printed Circuit Panels / Kok-Tee Lau, Hoi Ern Kok and Nur Hazirah Rosli. Universiti Teknologi MARA, 2021.
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