Three dimensional analysis using finite volume based CFD simulation to determine junction temperature on electronic components / Mazlan Mohamed, Rahim Atan and Mohd Zulkifly Abdullah

Three dimensional analysis using finite volume based CFD simulation to determine junction temperature on electronic components / Mazlan Mohamed, Rahim Atan and Mohd Zulkifly Abdullah

This paper presents the simulation of three dimensional numerical analysis of heat and fluid flow through chip package.

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Bibliographic Details
Main Authors: Mohamed, Mazlan (Author), Atan, Rahim (Author), Abdullah, Mohd Zulkifly (Author)
Format: Book
Published: Universiti Teknologi MARA Pulau Pinang, 2011.
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NonPeerReviewed
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Summary:This paper presents the simulation of three dimensional numerical analysis of heat and fluid flow through chip package.
Item Description:https://ir.uitm.edu.my/id/eprint/8790/1/MAZLAN%20MOHAMED.pdf

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