Three dimensional analysis using finite volume based CFD simulation to determine junction temperature on electronic components / Mazlan Mohamed, Rahim Atan and Mohd Zulkifly Abdullah
This paper presents the simulation of three dimensional numerical analysis of heat and fluid flow through chip package.
Saved in:
| Main Authors: | , , |
|---|---|
| Format: | Book |
| Published: |
Universiti Teknologi MARA Pulau Pinang,
2011.
|
| Subjects: | |
| Online Access: | Link Metadata |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
MARC
| LEADER | 00000 am a22000003u 4500 | ||
|---|---|---|---|
| 001 | repouitm_8790 | ||
| 042 | |a dc | ||
| 100 | 1 | 0 | |a Mohamed, Mazlan |e author |
| 700 | 1 | 0 | |a Atan, Rahim |e author |
| 700 | 1 | 0 | |a Abdullah, Mohd Zulkifly |e author |
| 245 | 0 | 0 | |a Three dimensional analysis using finite volume based CFD simulation to determine junction temperature on electronic components / Mazlan Mohamed, Rahim Atan and Mohd Zulkifly Abdullah |
| 260 | |b Universiti Teknologi MARA Pulau Pinang, |c 2011. | ||
| 500 | |a https://ir.uitm.edu.my/id/eprint/8790/1/MAZLAN%20MOHAMED.pdf | ||
| 520 | |a This paper presents the simulation of three dimensional numerical analysis of heat and fluid flow through chip package. | ||
| 546 | |a en | ||
| 690 | |a Heat | ||
| 655 | 7 | |a Article |2 local | |
| 655 | 7 | |a NonPeerReviewed |2 local | |
| 787 | 0 | |n https://ir.uitm.edu.my/id/eprint/8790/ | |
| 856 | 4 | 1 | |u https://ir.uitm.edu.my/id/eprint/8790/ |z Link Metadata |