Three dimensional analysis using finite volume based CFD simulation to determine junction temperature on electronic components / Mazlan Mohamed, Rahim Atan and Mohd Zulkifly Abdullah
This paper presents the simulation of three dimensional numerical analysis of heat and fluid flow through chip package.
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| Hoofdauteurs: | , , |
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| Formaat: | Boek |
| Gepubliceerd in: |
Universiti Teknologi MARA Pulau Pinang,
2011.
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Internet
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| Plaatsingsnummer: |
A1234.567 |
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| Kopie 1 | Beschikbaar |