Three dimensional analysis using finite volume based CFD simulation to determine junction temperature on electronic components / Mazlan Mohamed, Rahim Atan and Mohd Zulkifly Abdullah
This paper presents the simulation of three dimensional numerical analysis of heat and fluid flow through chip package.
Saved in:
| Main Authors: | , , |
|---|---|
| Format: | Book |
| Published: |
Universiti Teknologi MARA Pulau Pinang,
2011.
|
| Subjects: | |
| Online Access: | Link Metadata |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|