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  1. 1
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    Chapter MEMS Technologies Enabling the Future Wafer Test Systems by Tunaboylu, Bahadir

    Published 2018
    Subjects: “…wafer and package test systems, MEMS technology, interconnects, interposer, wafer probes…”
    DOAB: download the publication
    DOAB: description of the publication
    Electronic Book Chapter

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  2. 2
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    Chapter MEMS Technologies Enabling the Future Wafer Test Systems by Tunaboylu, Bahadir

    Published 2018
    Subjects: “…wafer and package test systems, MEMS technology, interconnects, interposer, wafer probes…”
    OAPEN Library: download the publication
    OAPEN Library: description of the publication
    Electronic Book Chapter

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  3. 3
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    Fracture, Fatigue, and Structural Integrity of Metallic Materials and Components Undergoing Random or Variable Amplitude Loadings

    Published 2022
    Subjects: “…testing systems…”
    DOAB: download the publication
    DOAB: description of the publication
    Electronic Book Chapter

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  4. 4
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    Smart Manufacturing

    Published 2022
    Subjects: “…test system…”
    DOAB: download the publication
    DOAB: description of the publication
    Electronic Book Chapter

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