Search Results - 1941年~

Refine Results
  1. 19701
  2. 19702

    Educated Youth and the Cultural Revolution in China by Singer, Martin

    Published 2020
    “…mpub.19144…”
    DOAB: download the publication
    DOAB: description of the publication
    Electronic Book Chapter
  3. 19703
  4. 19704
  5. 19705
  6. 19706
  7. 19707
  8. 19708
  9. 19709
  10. 19710
  11. 19711
  12. 19712
  13. 19713
  14. 19714
  15. 19715
  16. 19716
  17. 19717
  18. 19718

    Advancing Culture of Living with Landslides Volume 1 ISDR-ICL Sendai Partnerships 2015-2025 /

    Published 2017
    Table of Contents: “…Landslide Risk Reduction in Croatia: Scientific research in the framework of the WCoE 2014-2017, IPL-173, IPL-184, ICL ABN -- Shapes and Mechanisms of Large-scale Landslides in Japan: Forecasting Analysis from an Inventory (WCoE 2014-2017 -- Retrospective and Prospects for Cold Regions Landslide Research (2012-2016) (WCoE 2014-2017, IPL-132, IPL-167, IPL-203, CRLN -- Large-scale Rockslide Inventories: from the Kokomeren River Basin to the Entire Central Asia Region (WCoE 2014-2017, IPL-106-2) -- Interventions for Promoting Knowledge, Innovations and Landslide Risk Management Practices within South and Southeast Asia (WCoE 2014-2017) -- Promoting a Global Standard for Community-based Landslide Early Warning Systems (WCoE 2014-2017, IPL-158, IPL-165) -- Model Policy Frameworks, Standards and Guidelines on Landslide Disaster Reduction (WCoE 2014-2017) -- Landslide Hazard and Risk Management (WCoE 2014-2017) -- Mitigation of Landslide Hazards in Ukraine under the Guidance of ICL: 2009-2016 (IPL-153, IPL-191) -- Development of a Hazard Evaluation Technique for Earthquake-Induced Landslides Based on an Analytic Hierarchy Process (AHP) (IPL-154) -- The Croatian-Japanese SATREPS Joint Research Project on Landslides (IPL-161).…”
    Link to Metadata
    Electronic eBook
  19. 19719

    Semiconductor Devices Theory and Application by Fiore, James M.

    Published 2018
    Table of Contents: “…Chapter 1: Semiconductor Fundamentals -- 1.0 Chapter Objectives -- 1.1 Introduction -- 1.2 Atomic Structure -- 1.3 Crystals -- 1.4 Doped Materials -- Summary -- Chapter 2: PN Junctions and Diodes -- 2.0 Chapter Objectives -- 2.1 Introduction -- 2.2 The PN Junction -- 2.3 Diode Data Sheet Interpretation -- 2.4 Diode Circuit Models -- 2.5 Other Types of Diodes -- Summary -- Chapter 3: Diode Applications -- 3.0 Chapter Objectives -- 3.1 Introduction -- 3.2 Rectification -- 3.3 Clippers -- 3.4 Clampers -- Summary -- Chapter 4: Bipolar Junction Transistors (BJTs) -- 4.0 Chapter Objectives -- 4.1 Introduction -- 4.2 The Bipolar Junction Transistor -- 4.3 BJT Collector Curves -- 4.4 BJT Data Sheet Interpretation -- 4.5 Ebers-Moll Model -- 4.6 DC Load Lines -- 4.7 BJT Switching and Driver Applications -- Summary -- Chapter 5: BJT Biasing -- 5.0 Chapter Objectives -- 5.1 Introduction -- 5.2 The Need For Biasing -- 5.3 Two-Supply Emitter Bias -- 5.4 Voltage Divider Bias -- 5.5 Feedback Biasing -- Summary -- Chapter 6: Amplifier Concepts -- 6.0 Chapter Objectives -- 6.1 Introduction -- 6.2 Amplifier Model -- 6.3 Compliance and Distortion -- 6.4 Frequency Response and Noise -- 6.5 Miller's Theorem -- Summary -- Chapter 7: BJT Small Signal Amplifiers -- 7.0 Chapter Objectives -- 7.1 Introduction -- 7.2 Simplified AC Model of the BJT -- 7.3 Common Emitter Amplifier -- 7.4 Common Collector Amplifier -- 7.5 Common Base Amplifier -- 7.6 Multi-Stage Amplifiers -- Summary -- Chapter 8: BJT Class A Power Amplifiers -- 8.0 Chapter Objectives -- 8.1 Introduction -- 8.2 Amplifier Classes -- 8.3 Class A Operation and Load Lines -- 8.4 Loudspeakers -- 8.5 Power Transistor Data Sheet Interpretation -- 8.6 Heat Sinks -- Summary -- Chapter 9: BJT Class B Power Amplifiers -- 9.0 Chapter Objectives -- 9.1 Introduction -- 9.2 The Class B Configuration -- 9.3 Extensions and Refinements -- Summary -- Chapter 10: Junction Field Effect Transistors (JFETs) -- 10.0 Chapter Objectives -- 10.1 Introduction -- 10.2 JFET Internals -- 10.3 JFET Data Sheet Interpretation -- 10.4 JFET Biasing -- Summary -- Chapter 11: JFET Small Signal Amplifiers -- 11.0 Chapter Objectives -- 11.1 Introduction -- 11.2 Simplified AC Model of the JFET -- 11.3 Common Source Amplifier -- 11.4 Common Drain Amplifier -- 11.5 Multi-stage and Combination Circuits -- 11.6 Ohmic Region Operation -- Summary -- Chapter 12: Metal Oxide Semiconductor FETs (MOSFETs) -- 12.0 Chapter Objectives -- 12.1 Introduction -- 12.2 The DE-MOSFET -- 12.3 DE-MOSFET Biasing -- 12.4 The E-MOSFET -- 12.5 E-MOSFET Data Sheet Interpretation -- 12.6 E-MOSFET Biasing -- Summary -- Chapter 13: MOSFET Small Signal Amplifiers -- 13.0 Chapter Objectives -- 13.1 Introduction -- 13.2 MOSFET Common Source Amplifiers -- 13.3 MOSFET Common Drain Followers -- Summary -- Chapter 14: Class D Power Amplifiers -- 14.0 Chapter Objectives -- 14.1 Introduction -- 14.2 Class D Basics -- 14.3 Pulse Width Modulation -- 14.4 Output Configurations -- Summary -- Chapter 15: Insulated Gate Bipolar Transistors (IGBTs) -- 15.0 Chapter Objectives -- 15.1 Introduction -- 15.2 IGBT Internals -- 15.3 IGBT Data Sheet Interpretation -- 15.4 IGBT Applications -- Summary…”
    Access online version
    Electronic eBook
  20. 19720