Entwicklung keramischer Vergussmassen mit Alkoxysilanen zur Steigerung der Haftfestigkeit
The adhesion of encapsulation materials is an dendrimental factor for the robustness and functionality of a power electronic device. In this work the adhesion of ceramic potting materials was developed. A new primer was invented, that enabled high shear strengths even at high temperatures for short...
Enregistré dans:
| Auteur principal: | |
|---|---|
| Format: | Électronique Chapitre de livre |
| Publié: |
KIT Scientific Publishing
2023
|
| Sujets: | |
| Accès en ligne: | DOAB: download the publication DOAB: description of the publication |
| Tags: |
Ajouter un tag
Pas de tags, Soyez le premier à ajouter un tag!
|
| Résumé: | The adhesion of encapsulation materials is an dendrimental factor for the robustness and functionality of a power electronic device. In this work the adhesion of ceramic potting materials was developed. A new primer was invented, that enabled high shear strengths even at high temperatures for short times. Furthermore, a completely new potting material was invented on the basis of alkoxysilanes. Especially MTES showed beneficial properties for the adhesion under temperature load. |
|---|---|
| Description matérielle: | 1 electronic resource (220 p.) |
| ISBN: | KSP/1000156532 |
| Accès: | Open Access |