Kapak Resmi

Entwicklung keramischer Vergussmassen mit Alkoxysilanen zur Steigerung der Haftfestigkeit

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The adhesion of encapsulation materials is an dendrimental factor for the robustness and functionality of a power electronic device. In this work the adhesion of ceramic potting materials was developed. A new primer was invented, that enabled high shear strengths even at high temperatures for short...

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Detaylı Bibliyografya
Yazar: Kohler, Tobias (auth)
Materyal Türü: Elektronik Kitap Bölümü
Baskı/Yayın Bilgisi: KIT Scientific Publishing 2023
Konular:
Mechanical engineering & materials
Vergussmasse; Scherfestigkeit; Primer; Alkoxysilan; Leistungselektronik; Potting Material; Shear Strength; Alkoxysilane; Power Electronics
Online Erişim:DOAB: download the publication
DOAB: description of the publication
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Diğer Bilgiler
Özet:The adhesion of encapsulation materials is an dendrimental factor for the robustness and functionality of a power electronic device. In this work the adhesion of ceramic potting materials was developed. A new primer was invented, that enabled high shear strengths even at high temperatures for short times. Furthermore, a completely new potting material was invented on the basis of alkoxysilanes. Especially MTES showed beneficial properties for the adhesion under temperature load.
Fiziksel Özellikler:1 electronic resource (220 p.)
ISBN:KSP/1000156532
Erişim:Open Access

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