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Entwicklung keramischer Vergussmassen mit Alkoxysilanen zur Steigerung der Haftfestigkeit

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The adhesion of encapsulation materials is an dendrimental factor for the robustness and functionality of a power electronic device. In this work the adhesion of ceramic potting materials was developed. A new primer was invented, that enabled high shear strengths even at high temperatures for short...

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Bibliographic Details
Main Author: Kohler, Tobias (auth)
Format: Electronic Book Chapter
Published: KIT Scientific Publishing 2023
Subjects:
Mechanical engineering & materials
Vergussmasse; Scherfestigkeit; Primer; Alkoxysilan; Leistungselektronik; Potting Material; Shear Strength; Alkoxysilane; Power Electronics
Online Access:DOAB: download the publication
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Summary:The adhesion of encapsulation materials is an dendrimental factor for the robustness and functionality of a power electronic device. In this work the adhesion of ceramic potting materials was developed. A new primer was invented, that enabled high shear strengths even at high temperatures for short times. Furthermore, a completely new potting material was invented on the basis of alkoxysilanes. Especially MTES showed beneficial properties for the adhesion under temperature load.
Physical Description:1 electronic resource (220 p.)
ISBN:KSP/1000156532
Access:Open Access

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