Entwicklung keramischer Vergussmassen mit Alkoxysilanen zur Steigerung der Haftfestigkeit
The adhesion of encapsulation materials is an dendrimental factor for the robustness and functionality of a power electronic device. In this work the adhesion of ceramic potting materials was developed. A new primer was invented, that enabled high shear strengths even at high temperatures for short...
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| Format: | Électronique Chapitre de livre |
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KIT Scientific Publishing
2023
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| Accès en ligne: | DOAB: download the publication DOAB: description of the publication |
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