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Semiconductor Packaging Materials Interaction and Reliability

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In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the...

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Detalles Bibliográficos
Autor principal: Chen, Andrea (auth)
Otros Autores: Lo, Randy Hsiao-Yu (auth)
Formato: Electrónico Capítulo de libro
Lenguaje:inglés
Publicado: Taylor & Francis 2012
Materias:
Electronics engineering
Circuits & components
Materials science
Circuits and Devices
Electromagnetics and Microwaves
Electronic Packaging
ENG
MATERIALS
ElectricalEngineering
SCI-TECH
STM
array
ball
compound
frame
grid
lead
level
molding
package
wafer
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DOAB: download the publication
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