Semiconductor Packaging Materials Interaction and Reliability

Semiconductor Packaging Materials Interaction and Reliability

Show other versions (1)

In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the...

Full description

Saved in:
Bibliographic Details
Main Author: Chen, Andrea (auth)
Other Authors: Lo, Randy Hsiao-Yu (auth)
Format: Electronic Book Chapter
Language:English
Published: Taylor & Francis 2012
Subjects:
Electronics engineering
Circuits & components
Materials science
Circuits and Devices
Electromagnetics and Microwaves
Electronic Packaging
ENG
MATERIALS
ElectricalEngineering
SCI-TECH
STM
array
ball
compound
frame
grid
lead
level
molding
package
wafer
Online Access:DOAB: download the publication
DOAB: description of the publication
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a semiconductor package, the authors show how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world. The text also covers packaging materials for MEMS, solar technology, and LEDs and explores future trends in semiconductor packages.
Physical Description:1 electronic resource (216 p.)
ISBN:b11260
Access:Open Access

Similar Items