Semiconductor Packaging Materials Interaction and Reliability
In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the...
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| Format: | Electronic Book Chapter |
| Language: | English |
| Published: |
Taylor & Francis
2012
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| Subjects: | |
| Online Access: | DOAB: download the publication DOAB: description of the publication |
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| LEADER | 00000naaaa2200000uu 4500 | ||
|---|---|---|---|
| 001 | doab_20_500_12854_38988 | ||
| 005 | 20210210 | ||
| 003 | oapen | ||
| 006 | m o d | ||
| 007 | cr|mn|---annan | ||
| 008 | 20210210s2012 xx |||||o ||| 0|eng d | ||
| 020 | |a b11260 | ||
| 040 | |a oapen |c oapen | ||
| 024 | 7 | |a 10.1201/b11260 |c doi | |
| 041 | 0 | |a eng | |
| 042 | |a dc | ||
| 072 | 7 | |a TJF |2 bicssc | |
| 072 | 7 | |a TJFC |2 bicssc | |
| 072 | 7 | |a TGM |2 bicssc | |
| 100 | 1 | |a Chen, Andrea |4 auth | |
| 700 | 1 | |a Lo, Randy Hsiao-Yu |4 auth | |
| 245 | 1 | 0 | |a Semiconductor Packaging |b Materials Interaction and Reliability |
| 260 | |b Taylor & Francis |c 2012 | ||
| 300 | |a 1 electronic resource (216 p.) | ||
| 336 | |a text |b txt |2 rdacontent | ||
| 337 | |a computer |b c |2 rdamedia | ||
| 338 | |a online resource |b cr |2 rdacarrier | ||
| 506 | 0 | |a Open Access |2 star |f Unrestricted online access | |
| 520 | |a In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a semiconductor package, the authors show how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world. The text also covers packaging materials for MEMS, solar technology, and LEDs and explores future trends in semiconductor packages. | ||
| 540 | |a Creative Commons |f by-nc-nd/4.0 |2 cc |4 http://creativecommons.org/licenses/by-nc-nd/4.0 | ||
| 546 | |a English | ||
| 650 | 7 | |a Electronics engineering |2 bicssc | |
| 650 | 7 | |a Circuits & components |2 bicssc | |
| 650 | 7 | |a Materials science |2 bicssc | |
| 653 | |a Circuits and Devices | ||
| 653 | |a Electromagnetics and Microwaves | ||
| 653 | |a Electronic Packaging | ||
| 653 | |a ENG | ||
| 653 | |a MATERIALS | ||
| 653 | |a ElectricalEngineering | ||
| 653 | |a SCI-TECH | ||
| 653 | |a STM | ||
| 653 | |a array | ||
| 653 | |a ball | ||
| 653 | |a compound | ||
| 653 | |a frame | ||
| 653 | |a grid | ||
| 653 | |a lead | ||
| 653 | |a level | ||
| 653 | |a molding | ||
| 653 | |a package | ||
| 653 | |a wafer | ||
| 856 | 4 | 0 | |a www.oapen.org |u https://library.oapen.org/bitstream/20.500.12657/41662/1/9781439862070.pdf |7 0 |z DOAB: download the publication |
| 856 | 4 | 0 | |a www.oapen.org |u https://directory.doabooks.org/handle/20.500.12854/38988 |7 0 |z DOAB: description of the publication |