High Cycle Fatigue of Al and Cu Thin Films by a Novel High-Throughput Method

In the last two decades, the reliability of small electronic devices used in automotive or consumer electronics gained researchers attention. Thus, there is the need to understand the fatigue properties and damage mechanisms of thin films. In this thesis a novel high-throughput testing method for th...

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Bibliografische gegevens
Hoofdauteur: Burger, Sofie (auth)
Formaat: Elektronisch Hoofdstuk
Taal:Engels
Gepubliceerd in: KIT Scientific Publishing 2013
Reeks:Schriftenreihe des Instituts für Angewandte Materialien, Karlsruher Institut für Technologie
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