High Cycle Fatigue of Al and Cu Thin Films by a Novel High-Throughput Method
In the last two decades, the reliability of small electronic devices used in automotive or consumer electronics gained researchers attention. Thus, there is the need to understand the fatigue properties and damage mechanisms of thin films. In this thesis a novel high-throughput testing method for th...
Kaydedildi:
Yazar: | |
---|---|
Materyal Türü: | Elektronik Kitap Bölümü |
Dil: | İngilizce |
Baskı/Yayın Bilgisi: |
KIT Scientific Publishing
2013
|
Seri Bilgileri: | Schriftenreihe des Instituts für Angewandte Materialien, Karlsruher Institut für Technologie
|
Konular: | |
Online Erişim: | DOAB: download the publication DOAB: description of the publication |
Etiketler: |
Etiketle
Etiket eklenmemiş, İlk siz ekleyin!
|
Internet
DOAB: download the publicationDOAB: description of the publication
3rd Floor Main Library
Yer Numarası: |
A1234.567 |
---|---|
Kopya Bilgisi 1 | Kütüphanede |