High Cycle Fatigue of Al and Cu Thin Films by a Novel High-Throughput Method

In the last two decades, the reliability of small electronic devices used in automotive or consumer electronics gained researchers attention. Thus, there is the need to understand the fatigue properties and damage mechanisms of thin films. In this thesis a novel high-throughput testing method for th...

Full beskrivning

Sparad:
Bibliografiska uppgifter
Huvudskapare: Burger, Sofie (auth)
Materialtyp: Elektronisk Bokavsnitt
Språk:engelska
Publicerad: KIT Scientific Publishing 2013
Serie:Schriftenreihe des Instituts für Angewandte Materialien, Karlsruher Institut für Technologie
Ämnen:
Länkar:DOAB: download the publication
DOAB: description of the publication
Taggar: Lägg till en tagg
Inga taggar, Lägg till första taggen!

Internet

DOAB: download the publication
DOAB: description of the publication

3rd Floor Main Library

Beståndsuppgifter i 3rd Floor Main Library
Signum: A1234.567
Exemplar 1 Tillgänglig