High Cycle Fatigue of Al and Cu Thin Films by a Novel High-Throughput Method
In the last two decades, the reliability of small electronic devices used in automotive or consumer electronics gained researchers attention. Thus, there is the need to understand the fatigue properties and damage mechanisms of thin films. In this thesis a novel high-throughput testing method for th...
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| Format: | Electronic Book Chapter |
| Language: | English |
| Published: |
KIT Scientific Publishing
2013
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| Series: | Schriftenreihe des Instituts für Angewandte Materialien, Karlsruher Institut für Technologie
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| Subjects: | |
| Online Access: | DOAB: download the publication DOAB: description of the publication |
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| LEADER | 00000naaaa2200000uu 4500 | ||
|---|---|---|---|
| 001 | doab_20_500_12854_49267 | ||
| 005 | 20210211 | ||
| 003 | oapen | ||
| 006 | m o d | ||
| 007 | cr|mn|---annan | ||
| 008 | 20210211s2013 xx |||||o ||| 0|eng d | ||
| 020 | |a KSP/1000034759 | ||
| 020 | |a 9783731500254 | ||
| 040 | |a oapen |c oapen | ||
| 024 | 7 | |a 10.5445/KSP/1000034759 |c doi | |
| 041 | 0 | |a eng | |
| 042 | |a dc | ||
| 072 | 7 | |a TB |2 bicssc | |
| 100 | 1 | |a Burger, Sofie |4 auth | |
| 245 | 1 | 0 | |a High Cycle Fatigue of Al and Cu Thin Films by a Novel High-Throughput Method |
| 260 | |b KIT Scientific Publishing |c 2013 | ||
| 300 | |a 1 electronic resource (XII, 140 p. p.) | ||
| 336 | |a text |b txt |2 rdacontent | ||
| 337 | |a computer |b c |2 rdamedia | ||
| 338 | |a online resource |b cr |2 rdacarrier | ||
| 490 | 1 | |a Schriftenreihe des Instituts für Angewandte Materialien, Karlsruher Institut für Technologie | |
| 506 | 0 | |a Open Access |2 star |f Unrestricted online access | |
| 520 | |a In the last two decades, the reliability of small electronic devices used in automotive or consumer electronics gained researchers attention. Thus, there is the need to understand the fatigue properties and damage mechanisms of thin films. In this thesis a novel high-throughput testing method for thin films on Si substrate is presented. The specialty of this method is to test one sample at different strain amplitudes at the same time and measure an entire lifetime curve with only one experiment. | ||
| 540 | |a Creative Commons |f https://creativecommons.org/licenses/by-nc-nd/4.0/ |2 cc |4 https://creativecommons.org/licenses/by-nc-nd/4.0/ | ||
| 546 | |a English | ||
| 650 | 7 | |a Technology: general issues |2 bicssc | |
| 653 | |a damage structure | ||
| 653 | |a Fatigue | ||
| 653 | |a thin film | ||
| 653 | |a cantilever bending | ||
| 856 | 4 | 0 | |a www.oapen.org |u https://www.ksp.kit.edu/9783731500254 |7 0 |z DOAB: download the publication |
| 856 | 4 | 0 | |a www.oapen.org |u https://directory.doabooks.org/handle/20.500.12854/49267 |7 0 |z DOAB: description of the publication |