High Cycle Fatigue of Al and Cu Thin Films by a Novel High-Throughput Method

• Glavni autor: Burger, Sofie (auth)
• Format: Elektronički Poglavlje knjige
• Jezik: engleski
• Izdano: KIT Scientific Publishing 2013
• Serija: Schriftenreihe des Instituts für Angewandte Materialien, Karlsruher Institut für Technologie
• Teme: Technology: general issues; damage structure; Fatigue; thin film; cantilever bending
• Online pristup: DOAB: download the publication; DOAB: description of the publication

In the last two decades, the reliability of small electronic devices used in automotive or consumer electronics gained researchers attention. Thus, there is the need to understand the fatigue properties and damage mechanisms of thin films. In this thesis a novel high-throughput testing method for th...