High Cycle Fatigue of Al and Cu Thin Films by a Novel High-Throughput Method
In the last two decades, the reliability of small electronic devices used in automotive or consumer electronics gained researchers attention. Thus, there is the need to understand the fatigue properties and damage mechanisms of thin films. In this thesis a novel high-throughput testing method for th...
में बचाया:
मुख्य लेखक: | Burger, Sofie (auth) |
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स्वरूप: | इलेक्ट्रोनिक पुस्तक अध्याय |
भाषा: | अंग्रेज़ी |
प्रकाशित: |
KIT Scientific Publishing
2013
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श्रृंखला: | Schriftenreihe des Instituts für Angewandte Materialien, Karlsruher Institut für Technologie
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विषय: | |
ऑनलाइन पहुंच: | DOAB: download the publication DOAB: description of the publication |
टैग: |
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