High Cycle Fatigue of Al and Cu Thin Films by a Novel High-Throughput Method
In the last two decades, the reliability of small electronic devices used in automotive or consumer electronics gained researchers attention. Thus, there is the need to understand the fatigue properties and damage mechanisms of thin films. In this thesis a novel high-throughput testing method for th...
Tallennettuna:
| Päätekijä: | |
|---|---|
| Aineistotyyppi: | Elektroninen Kirjan osa |
| Kieli: | englanti |
| Julkaistu: |
KIT Scientific Publishing
2013
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| Sarja: | Schriftenreihe des Instituts für Angewandte Materialien, Karlsruher Institut für Technologie
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| Aiheet: | |
| Linkit: | DOAB: download the publication DOAB: description of the publication |
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