Influence of strain on the functionality of ink-jet printed thin films and devices on flexible substrates

• Váldodahkki: Mishra, Nilesha (auth)
• Materiálatiipa: Elektrovnnalaš Girjji oassi
• Giella: eaŋgalasgiella
• Almmustuhtton: KIT Scientific Publishing 2019
• Ráidu: Schriftenreihe des Instituts für Angewandte Materialien, Karlsruher Institut für Technologie
• Fáttát: Technology: general issues; elektromechanische Charakterisierung; flexible Elektronik; thin-film devices; Ink-jet printing; flexible electronics; synchrotron X-ray diffraction; Dünnschichtbauteil; Ink-jet drucken; Synchrotron-Röntgenbeugung; electro-mechanical characterization
• Liŋkkat: DOAB: download the publication; DOAB: description of the publication

Čoahkkáigeassu

Ink-jet printed devices on the flexible substrate are inexpensive and large area compatible as compared to rigid substrates. However, during fabrication and service they are subjected to complex strains, resulting in crack formation or delamination within the layers, affecting the device performance. Therefore, it is necessary to understand their failure mechanisms by correlating their electrical or structural properties with applied strain, supported by detailed microstructural investigations.

Olgguldas hápmi

1 electronic resource (X, 127 p. p.)

ISBN

KSP/1000086125
9783731508533

Beassan

Open Access