Photonic Wire Bonding as a Novel Technology for Photonic Chip Interfaces

• मुख्य लेखक: Lindenmann, Nicole (auth)
• स्वरूप: इलेक्ट्रोनिक पुस्तक अध्याय
• भाषा: अंग्रेज़ी
• प्रकाशित: KIT Scientific Publishing 2018
• श्रृंखला: Karlsruhe Series in Photonics and Communications / Karlsruhe Institute of Technology, Institute of Photonics and Quantum Electronics (IPQ)
• विषय: Technology: general issues; optische Aufbau- und Verbindungstechnik; Photonic Wire Bonding; optical interconnects; photonic integrated circuits; integrierte Photonik; Silizium-Photonik; silicon photonics; photonic wire bonding
• ऑनलाइन पहुंच: DOAB: download the publication; DOAB: description of the publication

To create photonic multi-chip modules, integrated photonic chips need to be connected internally and to external glass fibers. A novel approach to address this task is the concept of photonic wire bonding, where free-standing polymer waveguides are printed in-situ by two-photon polymerization. This...