Photonic Wire Bonding as a Novel Technology for Photonic Chip Interfaces

• Main Author: Lindenmann, Nicole (auth)
• Format: Electronic Book Chapter
• Language: English
• Published: KIT Scientific Publishing 2018
• Series: Karlsruhe Series in Photonics and Communications / Karlsruhe Institute of Technology, Institute of Photonics and Quantum Electronics (IPQ)
• Subjects: Technology: general issues; optische Aufbau- und Verbindungstechnik; Photonic Wire Bonding; optical interconnects; photonic integrated circuits; integrierte Photonik; Silizium-Photonik; silicon photonics; photonic wire bonding
• Online Access: DOAB: download the publication; DOAB: description of the publication

To create photonic multi-chip modules, integrated photonic chips need to be connected internally and to external glass fibers. A novel approach to address this task is the concept of photonic wire bonding, where free-standing polymer waveguides are printed in-situ by two-photon polymerization. This...