Lindenmann, N. (2018). Photonic Wire Bonding as a Novel Technology for Photonic Chip Interfaces. KIT Scientific Publishing.
Chicago Style (17th ed.) CitationLindenmann, Nicole. Photonic Wire Bonding as a Novel Technology for Photonic Chip Interfaces. KIT Scientific Publishing, 2018.
MLA (9th ed.) CitationLindenmann, Nicole. Photonic Wire Bonding as a Novel Technology for Photonic Chip Interfaces. KIT Scientific Publishing, 2018.
Warning: These citations may not always be 100% accurate.