Lindenmann, N. (2018). Photonic Wire Bonding as a Novel Technology for Photonic Chip Interfaces. KIT Scientific Publishing.
Chicago-Zitierstil (17. Ausg.)Lindenmann, Nicole. Photonic Wire Bonding as a Novel Technology for Photonic Chip Interfaces. KIT Scientific Publishing, 2018.
MLA-Zitierstil (9. Ausg.)Lindenmann, Nicole. Photonic Wire Bonding as a Novel Technology for Photonic Chip Interfaces. KIT Scientific Publishing, 2018.
Achtung: Diese Zitate sind unter Umständen nicht zu 100% korrekt.