Photonic Wire Bonding as a Novel Technology for Photonic Chip Interfaces

To create photonic multi-chip modules, integrated photonic chips need to be connected internally and to external glass fibers. A novel approach to address this task is the concept of photonic wire bonding, where free-standing polymer waveguides are printed in-situ by two-photon polymerization. This...

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Bibliographic Details
Main Author: Lindenmann, Nicole (auth)
Format: Electronic Book Chapter
Language:English
Published: KIT Scientific Publishing 2018
Series:Karlsruhe Series in Photonics and Communications / Karlsruhe Institute of Technology, Institute of Photonics and Quantum Electronics (IPQ)
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Online Access:DOAB: download the publication
DOAB: description of the publication
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520 |a To create photonic multi-chip modules, integrated photonic chips need to be connected internally and to external glass fibers. A novel approach to address this task is the concept of photonic wire bonding, where free-standing polymer waveguides are printed in-situ by two-photon polymerization. This book contains a detailed description of the methodology of photonic wire bonding together with a number of key experiments. 
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653 |a optical interconnects 
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653 |a Silizium-Photonik 
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653 |a photonic wire bonding 
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