Surface and Interface Engineering for Organic Device Applications

• Altri autori: Kim, Ju-Hyung (Redattore)
• Natura: Elettronico Capitolo di libro
• Lingua: inglese
• Pubblicazione: Basel, Switzerland MDPI - Multidisciplinary Digital Publishing Institute 2021
• Soggetti: Technology: general issues; silk fibroin; hybrid nanoflowers surface; Pb(II) removal; interaction mechanism; off-axis conic surface; shape accuracy; auto-collimation; single CGH; hybrid compensation; organic electronics; liquid semiconductors; charge injection; surface engineering; crack engineering; eutectic gallium indium; EGaIn; liquid metal; gallium alloy; flexible photodetector; flexible electronics; perovskite solar cells; performance improvement; lead acetate; cesium doping; stimuli-responsive hydrogels; thermogelling polymers; sol-gel transition behaviors; complex colloidal systems; conducting polymer; PEDOT:PSS; electrical conductivity; processing additive; linear glycol; sigmoidal function; liquid metals; gallium alloys; Galinstan; flexible electronics photodetectors; solar-blind photodetection; n/a
• Accesso online: DOAB: download the publication; DOAB: description of the publication

In the last few decades, organic materials (or carbon-based materials in a broad sense), including polymers, have received much attention for their potential applications in electronics, because they have outstanding advantages such as high processibility, mechanical flexibility, and low weight. Ext...