Advanced Interconnect and Packaging
Unlike transistors, the continuous downscaling of feature size in CMOS technology leads to a dramatic rise in interconnect resistivity and concomitant performance degradation. At nanoscale technology nodes, interconnect delay and reliability become the major bottlenecks faced by modern integrated ci...
Tallennettuna:
Muut tekijät: | |
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Aineistotyyppi: | Elektroninen Kirjan osa |
Kieli: | englanti |
Julkaistu: |
Basel
MDPI - Multidisciplinary Digital Publishing Institute
2023
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Aiheet: | |
Linkit: | DOAB: download the publication DOAB: description of the publication |
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Internet
DOAB: download the publicationDOAB: description of the publication
3rd Floor Main Library
Hyllypaikka: |
A1234.567 |
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Nide 1 | Saatavissa |