Advanced Interconnect and Packaging

Unlike transistors, the continuous downscaling of feature size in CMOS technology leads to a dramatic rise in interconnect resistivity and concomitant performance degradation. At nanoscale technology nodes, interconnect delay and reliability become the major bottlenecks faced by modern integrated ci...

Full description

Saved in:
Bibliographic Details
Other Authors: Zhao, Wensheng (Editor)
Format: Electronic Book Chapter
Language:English
Published: Basel MDPI - Multidisciplinary Digital Publishing Institute 2023
Subjects:
n/a
Online Access:DOAB: download the publication
DOAB: description of the publication
Tags: Add Tag
No Tags, Be the first to tag this record!

Internet

DOAB: download the publication
DOAB: description of the publication

3rd Floor Main Library

Holdings details from 3rd Floor Main Library
Call Number: A1234.567
Copy 1 Available