Zhao, W. (2023). Advanced Interconnect and Packaging. MDPI - Multidisciplinary Digital Publishing Institute.
Chicago Style (17th ed.) CitationZhao, Wensheng. Advanced Interconnect and Packaging. Basel: MDPI - Multidisciplinary Digital Publishing Institute, 2023.
MLA (9th ed.) CitationZhao, Wensheng. Advanced Interconnect and Packaging. MDPI - Multidisciplinary Digital Publishing Institute, 2023.
Warning: These citations may not always be 100% accurate.