कवर छवि

Hybrid photonic assemblies based on 3D-printed coupling structures

अन्य संस्करण दिखाएं (1)

Photonic integrated circuits (PIC) become increasingly important for numerous applications. Mass production of PIC has become widely available, but large-volume low-cost photonic packaging still represents a challenge. Additive micro-fabrication of free-form optical coupling structures is discussed...

पूर्ण विवरण

में बचाया:

ग्रंथसूची विवरण
मुख्य लेखक:	Xu, Yilin (auth)
स्वरूप:	इलेक्ट्रोनिक पुस्तक अध्याय
भाषा:	अंग्रेज़ी
प्रकाशित:	KIT Scientific Publishing 2023
श्रृंखला:	Karlsruhe Series in Photonics & Communications
विषय:	Electrical engineering Photonische Aufbau- und Verbindungstechnik; integrierte photonische Schaltkreise; Multiphotonenlithographie; additive 3D Mikrofabrikation; Mikrooptik; photonic packaging; photonic integrated circuits (PIC); multi-photon lithographie; additive 3D micro-fabrication; micro-optics
ऑनलाइन पहुंच:	DOAB: download the publication DOAB: description of the publication
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