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Hybrid photonic assemblies based on 3D-printed coupling structures

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Photonic integrated circuits (PIC) become increasingly important for numerous applications. Mass production of PIC has become widely available, but large-volume low-cost photonic packaging still represents a challenge. Additive micro-fabrication of free-form optical coupling structures is discussed...

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Bibliografische gegevens
Hoofdauteur: Xu, Yilin (auth)
Formaat: Elektronisch Hoofdstuk
Taal:Engels
Gepubliceerd in: KIT Scientific Publishing 2023
Reeks:Karlsruhe Series in Photonics & Communications
Onderwerpen:
Electrical engineering
Photonische Aufbau- und Verbindungstechnik; integrierte photonische Schaltkreise; Multiphotonenlithographie; additive 3D Mikrofabrikation; Mikrooptik; photonic packaging; photonic integrated circuits (PIC); multi-photon lithographie; additive 3D micro-fabrication; micro-optics
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DOAB: description of the publication
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