Hybrid photonic assemblies based on 3D-printed coupling structures
Photonic integrated circuits (PIC) become increasingly important for numerous applications. Mass production of PIC has become widely available, but large-volume low-cost photonic packaging still represents a challenge. Additive micro-fabrication of free-form optical coupling structures is discussed...
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Main Author: | |
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Format: | Electronic Book Chapter |
Language: | English |
Published: |
KIT Scientific Publishing
2023
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Series: | Karlsruhe Series in Photonics & Communications
28 |
Subjects: | |
Online Access: | OAPEN Library: download the publication OAPEN Library: description of the publication |
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OAPEN Library: download the publicationOAPEN Library: description of the publication
3rd Floor Main Library
Call Number: |
A1234.567 |
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Copy 1 | Available |