Soft Encapsulation of Flexible Electrical Stimulation Implant: Challenges and Innovations
In this document we discuss the main challenges encountered when producing flexible electrical stimulation implants, and present our approach to solving them for prototype production. We include a study of the optimization of the flexible PCB design, the selection of additive manufacturing materials...
Saved in:
Main Authors: | , , , , , , , |
---|---|
Format: | Book |
Published: |
PAGEPress Publications,
2016-11-01T00:00:00Z.
|
Subjects: | |
Online Access: | Connect to this object online. |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Internet
Connect to this object online.3rd Floor Main Library
Call Number: |
A1234.567 |
---|---|
Copy 1 | Available |