Soft Encapsulation of Flexible Electrical Stimulation Implant: Challenges and Innovations
In this document we discuss the main challenges encountered when producing flexible electrical stimulation implants, and present our approach to solving them for prototype production. We include a study of the optimization of the flexible PCB design, the selection of additive manufacturing materials...
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Main Authors: | , , , , , , , |
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Formato: | Libro |
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PAGEPress Publications,
2016-11-01T00:00:00Z.
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Acceso en liña: | Connect to this object online. |
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Internet
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Número de Clasificación: |
A1234.567 |
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Copia 1 | Dispoñible |