Study of some thermal properties and activation energy of epoxy resin alloys with copper complex of acid N, N-5,2-toluene di-malic acid
<strong>ABSTRACT</strong><br /> Research includes the study of thermal isothermal Epoxy resin alloy with copper complex,( N,N - 2,5 Tolylene bismaleamic acid Copper (2,5TBMA Cu), through thermal analysis measurements weighted at temperature constant time it takes to reach the cons...
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| Format: | Book |
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College of Education for Pure Sciences,
2013-12-01T00:00:00Z.
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| Online Access: | Connect to this object online. |
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Internet
Connect to this object online.3rd Floor Main Library
| Call Number: |
A1234.567 |
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| Copy 1 | Available |