Study of some thermal properties and activation energy of epoxy resin alloys with copper complex of acid N, N-5,2-toluene di-malic acid
<strong>ABSTRACT</strong><br /> Research includes the study of thermal isothermal Epoxy resin alloy with copper complex,( N,N - 2,5 Tolylene bismaleamic acid Copper (2,5TBMA Cu), through thermal analysis measurements weighted at temperature constant time it takes to reach the cons...
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Format: | Book |
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College of Education for Pure Sciences,
2013-12-01T00:00:00Z.
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Summary: | <strong>ABSTRACT</strong><br /> Research includes the study of thermal isothermal Epoxy resin alloy with copper complex,( N,N - 2,5 Tolylene bismaleamic acid Copper (2,5TBMA Cu), through thermal analysis measurements weighted at temperature constant time it takes to reach the constant weight within 23 minutes compared to 17 minutes for the epoxy alone. It has been treated at temperatures, was a high values end CDT decomposition and a percentage values weighted 350 (% Wt) whenever the temperature increased treatment .When treatment had employed resulted to a higher values of the weighted at 350 C° (Wt%)<sub>350</sub> in the middle neutral. Fuoss equation had been used to calculate the activation energy for the beginning of the process of disintegration polymeric material. |
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Item Description: | 1812-125X 2664-2530 10.33899/edusj.2013.163105 |