Study of some thermal properties and activation energy of epoxy resin alloys with copper complex of acid N, N-5,2-toluene di-malic acid
<strong>ABSTRACT</strong><br /> Research includes the study of thermal isothermal Epoxy resin alloy with copper complex,( N,N - 2,5 Tolylene bismaleamic acid Copper (2,5TBMA Cu), through thermal analysis measurements weighted at temperature constant time it takes to reach the cons...
Saved in:
| Main Authors: | , |
|---|---|
| Format: | Book |
| Published: |
College of Education for Pure Sciences,
2013-12-01T00:00:00Z.
|
| Subjects: | |
| Online Access: | Connect to this object online. |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|