Nanoparticle Engineering for Chemical-Mechanical Planarization Fabrication of Next-Generation Nanodevices
Increasing reliance on electronic devices demands products with high performance and efficiency. Such devices can be realized through the advent of nanoparticle technology. This book explains the physicochemical properties of nanoparticles according to each step in the chemical mechanical planarizat...
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Format: | Electronic Book Chapter |
Language: | English |
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Taylor & Francis
2009
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Online Access: | OAPEN Library: download the publication OAPEN Library: description of the publication |
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LEADER | 00000naaaa2200000uu 4500 | ||
---|---|---|---|
001 | oapen_2024_20_500_12657_25193 | ||
005 | 20190426 | ||
003 | oapen | ||
006 | m o d | ||
007 | cr|mn|---annan | ||
008 | 20190426s2009 xx |||||o ||| 0|eng d | ||
020 | |a 9780429291890 | ||
020 | |a 9781000023220 | ||
020 | |a 9780367446062 | ||
020 | |a 9781420059113 | ||
020 | |a 9780429291890 | ||
020 | |a 9781420059137 | ||
040 | |a oapen |c oapen | ||
024 | 7 | |a 10.1201/9780429291890 |c doi | |
041 | 0 | |a eng | |
042 | |a dc | ||
072 | 7 | |a TBN |2 bicssc | |
100 | 1 | |a Paik, Ungyu |4 auth | |
700 | 1 | |a Park, Jea-Gun |4 auth | |
245 | 1 | 0 | |a Nanoparticle Engineering for Chemical-Mechanical Planarization |b Fabrication of Next-Generation Nanodevices |
260 | |b Taylor & Francis |c 2009 | ||
336 | |a text |b txt |2 rdacontent | ||
337 | |a computer |b c |2 rdamedia | ||
338 | |a online resource |b cr |2 rdacarrier | ||
506 | 0 | |a Open Access |2 star |f Unrestricted online access | |
520 | |a Increasing reliance on electronic devices demands products with high performance and efficiency. Such devices can be realized through the advent of nanoparticle technology. This book explains the physicochemical properties of nanoparticles according to each step in the chemical mechanical planarization (CMP) process, including dielectric CMP, shallow trend isolation CMP, metal CMP, poly isolation CMP, and noble metal CMP. The authors provide a detailed guide to nanoparticle engineering of novel CMP slurry for next-generation nanoscale devices below the 60nm design rule. This comprehensive text also presents design techniques using polymeric additives to improve CMP performance. | ||
536 | |a Knowledge Unlatched | ||
540 | |a Creative Commons |f https://creativecommons.org/licenses/by-nc-nd/4.0/legalcode |2 cc |4 https://creativecommons.org/licenses/by-nc-nd/4.0/legalcode | ||
546 | |a English | ||
650 | 7 | |a Nanotechnology |2 bicssc | |
653 | |a Material Sciences | ||
856 | 4 | 0 | |a www.oapen.org |u https://library.oapen.org/bitstream/id/088e9551-2a17-4bd8-a965-07002ed7cdee/1004898.pdf |7 0 |z OAPEN Library: download the publication |
856 | 4 | 0 | |a www.oapen.org |u http://library.oapen.org/handle/20.500.12657/25193 |7 0 |z OAPEN Library: description of the publication |